4N5 High Purity Titanium Sputtering Target
4N5 High‑Purity Titanium Sputtering Target (99.995% Ti) is a premium metal sputtering source material widely adopted for magnetron sputtering, PVD vacuum coating, semiconductor thin‑film deposition, optoelectronic research and laboratory applications. Our titanium sputtering targets can be customized in different shapes and dimensions to satisfy diverse customer technical requirements.
Titanium Element Basic Introduction
- Element Symbol: Ti
- CAS No.: 7440‑32‑6
- Density: 4.506 g·cm⁻³
- Physical State: Solid
- Melting Point: 1668 °C
- Boiling Point: 3287 °C
- Enthalpy of fusion: 14.15 kJ·mol⁻¹
- Enthalpy of vaporization: 425 kJ·mol⁻¹
- Molar heat capacity: 25.060 J·mol⁻¹·K⁻¹
Material Physical‑Chemical Properties
- Crystal Structure: Hexagonal close‑packed
- Magnetic Order: Paramagnetic
- Thermal Expansion Coefficient (25 °C): 8.6 μm·m⁻¹·K⁻¹
- Thermal Conductivity: 21.9 W·m⁻¹·K⁻¹
- Electrical Resistivity (20 °C): 0.420 nΩ·m
- Young’s Modulus: 116 GPa
- Shear Modulus: 44 GPa
- Poisson’s Ratio: 0.32
- Mohs Hardness: 6.0
- Brinell Hardness: 716 MPa
Our 4N5 titanium sputtering target features ultra‑high purity, dense microstructure and low impurity content. It delivers stable sputtering rate, uniform thin‑film quality and fewer particle defects during PVD coating process, which makes it well‑suited for semiconductor barrier layers, optical coating, decorative coating and scientific research projects.
We support custom specifications including round, rectangular planar targets and backing‑plate bonded targets. If you need custom size, drawing evaluation or bulk order quotation, please feel free to reach our sales team.
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